By Duixian Liu; et al
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Additional resources for Advanced millimeter-wave technologies : antennas, packaging and circuits
Wachnik, and K. Walter, ‘Silicon germanium based millimetre-wave ICs for Gbps wireless communications and radar systems’, Semiconductor Science and Technology 22(1) (2007), S236– S243.  S. Reynolds, B. Floyd, U. Pfeiffer, T. Beukema, J. Grzyb, C. Haymes, B. Gaucher, and M. Soyuer, ‘A silicon 60 GHz receiver and transmitter chipset for broadband communications’, IEEE J. SolidState Circuits 41(12) (2006), 2820–30.  B. Floyd, S. Reynolds, U. Pfeiffer, T. Beukema, J. Grzyb, and C. Haymes, ‘A silicon 60GHz receiver and transmitter chipset for broadband communications’, IEEE ISSCC Dig.
Chapter 14 takes the phased array concepts and importance highlighted in Chapter 13 another step forward as integrated phased arrays, essentially trying to address the cost of commercial and consumer products such as automotive radar, imaging, sensing and other systems through very high levels of integration. The discussion begins with basic principles of phased arrays, their benefits and the challenges of integration, specifically in silicon. Silicon-based antennas are discussed along with fundamental phased array architectures from RF, IF to LO.
Floyd, S. Reynolds, U. Pfeiffer, T. Beukema, J. Grzyb, and C. Haymes, ‘A silicon 60GHz receiver and transmitter chipset for broadband communications’, IEEE ISSCC Dig. Tech. Papers, February 2006, pp. 184–5.  N. , ‘High-efficiency 60 GHz antenna fabricated using low-cost silicon micromachining techniques’, IEEE International Symposium on Antennas and Propagation, Honolulu, Hawaii, June 9–15, 2007, pp. 5043–46. 2 Millimeter-wave Packaging Ullrich Pfeiffer List of Acronyms µPGA Micro PGA ASK Amplitude shift keying BCA Bare chip attach BCC Bump chip carrier BEOL Back-end-of-the-line BGA Ball grid array BiCMOS Bipolar CMOS BIST Built-in self-test BT Bismaleide-triazine C4 Controlled collapse chip connection CLCC Ceramic leaded chip carrier CMOS Complementary metal–oxide–semiconductor CNC Computer numerical control COB Chip on board Advanced Millimeter-Wave Technologies: Antennas, Packaging and Circuits Duixian Liu, Brian Gaucher, Ulrich Pfeiffer and Janusz Grzyb © 2009 John Wiley & Sons, Ltd.
Advanced millimeter-wave technologies : antennas, packaging and circuits by Duixian Liu; et al